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Lexar ARMOR 700 Portable SSD Review: Power-Efficient 2 GBps in an IP66 Package

Lexar has a long history of serving the flash-based consumer storage market in the form of SSDs, memory cards, and USB flash drives. After having started out as a Micron brand, the company was acquired by Longsys which has diversified its product lineup with regular introduction of new products. Recently, the company announced a number of portable SSDs...

Thu May 30, 2024 16:00
Arm Unveils 2024 CPU Core Designs, Cortex X925, A725 and A520: Arm v9.2 Redefined For 3nm

As the semiconductor industry continues to evolve, Arm stands at the forefront of innovation for its core and IP architecture, especially in the mobile space, by pushing the boundaries of technology to deliver cutting-edge solutions for end users. For 2024, Arm's year-on-year strategic advancements focus on enhancing last year's Armv9.2 architecture...

Wed May 29, 2024 18:58
Rapidus Adds Chip Packaging Services to Plans for $32 Billion 2nm Fab

To say that the global foundry market is booming right now would be an understatement. Demand for leading-edge process technologies driven by AI and HPC applications is unprecedented, and with Intel joining the contract chipmaking game, this market segment is once again becoming rather competitive as well. Yet, this is exactly the market segment that...

Fri May 24, 2024 23:45
MSI Teases Z790 Project Zero Plus Motherboard With CAMM2 Memory Support

MSI on Thursday published the first image of a new desktop motherboard that supports the innovative DDR5 compression attached memory module (CAMM2). DDR5 CAMM2 modules are designed to improve upon the SO-DIMM form factor used for laptops, alleviating some of the high-speed signaling and capacity limitations of SO-DIMMs while also shaving down on the...

Fri May 24, 2024 15:45
ASUS NUC14RVHv7 and ASRock Industrial NUC BOX-155H Review: Meteor Lake Brings Accelerated AI to UCFF PCs

Intel's Meteor Lake series of processors has had a drawn-out launch since its details were officially presented in September 2023. The series marks Intel's foray into the consumer market with a tile-based chiplet configuration held together with Foveros packaging. Similar to Tiger Lake, the focus of Meteor Lake has primarily been on the mobile market...

Thu May 23, 2024 15:41
TSMC's Roadmap at a Glance: N3X, N2P, A16 Coming in 2025/2026

As announced last week by TSMC, later this year the company is set to start high-volume manufacturing on its N3P fabrication process, and this will be the company's most advanced node for a while. Next year things will get a bit more interesting as TSMC will have two process technologies that could actually compete against each other when they enter...

Thu May 23, 2024 01:34

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